Wafers are the foundation of semiconductor chip manufacturing. The growing demand for semiconductors, driven by technological advancements like AI, IoT, and robotics, makes it crucial to handle these delicate wafers efficiently and precisely. In this article, we will explain how unified features from a family of motors and actuators can simplify process automation for semiconductor wafers.
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What is a wafer?
A wafer is a thin slice of semiconductor material, such as silicon, used for manufacturing integrated circuits (ICs). ICs are used in all kinds of electronic applications, such as smartphones, automobiles, and robots.
These wafers are circular in shape and can range from a few inches to over a foot in diameter, depending on the manufacturer. Since they hold an array of microscopic circuits and can break easily, wafers need to be handled delicately inside a controlled environment to prevent costly damage.
Source: TechCrunch
How can the AlphaStep AZ Series product family simplify wafer transfer?
Motors, linear actuators, and rotary actuators from Oriental Motor's AlphaStep AZ Series product family offer universal features, drivers, and software. All motor systems are equipped with a battery-free absolute encoder, low-loss lamination technology, and reliable Keep-in-Step technology with automatic correction. The driver's servo-emulation mode enables high efficiency, low-noise operation where the motor uses just the right amount of current for the motion profile.
These products are modular; meaning different types of motors, actuators, and drivers can be mixed and matched according to your needs.
The simplified setup not only reduces the material costs, wiring time, and problems related to sensors but also enhances functionality without sacrificing performance.
We will go over three motion axes typically used in a wafer handling process: the loading/loading axis, the transfer process, and the alignment process.
Jump to section:
Loading/Unloading
Wafer Transfer
Wafer Alignment
Loading/Unloading
Semiconductor wafers need to be lifted and lowered from time to time, such as in a loading/unloading axis. By using the L Series that combines an integrated closed-loop stepper motor with a rack-and-pinion mechanism, a high precision and high load vertical drive can be performed with ease.
Operation of a rack-and-pinion system
The gear (deceleration unit) is driven by the pinion shaft of the motor, and further transmits it from the pinion gear then to the rack to convert it into linear motion.
Components used
&#; Fixed-side block &#; Transportation table &#; Linear guide &#; Support-side block &#; Coupling case &#; Coupling &#; Fixed-side bearing &#; Ball screw &#; Support-side bearing
Due to the built-in battery-free encoder, external sensors can also be eliminated.
Repetitive positioning accuracy (reference value)
This is the actual measurement value with a transportable mass. It will vary depending on the load, driving conditions, and mounting direction.
Product Name
Rack Moving Method
Repetitive Positioning Accuracy [mm]
LM2
Parallel
±0.25
LM4
LM2
Perpendicular
±0.07
LM4
Easy unit setting
By using the universal MEXE02 support software, the travel amount can be set easily in millimeter units instead of steps or degrees.
- Minimum step angle
- High-Speed Type: 0.01 mm
Large Transportable Mass Type: 0.001 mm
- Operating speed range
- 0~500 mm/s (High-speed type)
0~90 mm/s (60 mm frame size for large transportable mass type)
0~40 mm/s (80 mm frame size for large transportable mass type)
L Series Rack and Pinion Systems
Wafer Transfer
Wafer transfer stations present unique challenges, including high inertia handling and the need for precise operations. The closed-loop AZ series stepper motors with harmonic gearhead offer tailored solutions to meet these demanding requirements.
- High accuracy/non-backlash
Unlike other gearheads, a harmonic gearhead provides backlash-free positioning accuracy. The harmonic gear has many teeth in simultaneous meshing engagement, and it is designed to average out the effects of tooth pitch error and cumulative pitch error to ensure high positioning accuracy (0.025˚ to 0.017˚ depending on size).
AZ Series Stepper Motors (Harmonic Gear Type)
Wafer Alignment
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North America Soft Connection Laser Welding Machine ...Semiconductor wafer handling requires precision, high responsiveness, and synchronization between multiple motors and actuators. Oriental Motor's DR/DRS Series compact cylinders with the same closed-loop technology from the AlphaStep AZ series motors provide characteristics that can do exactly that. With a hollow rotor and direct assembly design, rigidity is improved while backlash is reduced.
- Precise and responsive
These compact cylinders are highly responsive and reliable due to the built-in AlphaStep closed-loop technology, making them ideal for wafer handling tasks. Notably, they are tuning-free, further simplifying setup.
Ball screw type:
ground or rolled
Minimum Step Angle:
0.001 mm
Repetitive Positioning Accuracy:
Ground Ball Screw: ±0.003 mm
Rolled Ball Screw: ±0.01 mm
4-axis EtherCAT-compatible controller
Consolidate:
- Main power supply cable
- Control power supply cable
- Communication cable
- Motor cables
Self-built
&#; Mounting plate &#; Transportation table &#; Linear guide &#; Coupling &#; Fixed-side block &#; Ball screw &#; Fixed-side bearing &#; Support-side block &#; Support-side bearing
When using DR Series table type
The DR Series is pre-assembled
with all necessary components
and offers space savings.
4 mounting methods
With various mounting methods available, allowing for flexible mounting options to suit small spaces. Through multiple combinations, an XYZ unit can be configured to create compact equipment.
Front mounting
Side mounting
Flange mounting
Foot mounting
DR/DRS Series Compact Cylinders
Summary
In semiconductor wafer handling, precision and reliability are paramount, and Oriental Motor offers a diverse range of motor and linear actuator options to meet these stringent requirements. Using products that share universal features and functions can simplify setup and programming while saving time and resources for something more important.
Unified control for a wide variety of applications
The αSTEP AZ Series product family offers a wide, modular product line of motors, geared motors, linear/rotary actuators, grippers, and drivers. By using universal drivers, software, and cables, the wiring and control are unified for a variety of motors and actuator options.
Benefits of Unification
Because the I/O pin layout is the same, electrical design and wiring work can be performed efficiently.
Since the control method is the same, different operations can be performed using the same method (including network control).
Because they share the same motor, driver and cables, it is possible to reduce the inventory costs and storage space.
Related article: Optimal Motors for Chemical Mechanical Polishing of Wafers
Related article: Redefining Precision and Reliability for Wafer Pin Lifters
The AZ Series product family also offers an industrial network compatible lineup that enables seamless integration into advanced control systems via EtherNetIP, EtherCAT, Profinet, or other communication protocols, providing the flexibility and efficiency required in the semiconductor industry. We are constantly updating the technology and expanding the lineup, such as the new high power EtherNetIP and EtherCAT-compatible AZX Series.
Oriental Motor - your go-to source for compact precision motion control
Oriental Motor's motors and linear actuators can be used to enhance precision, reduce complexity, and ensure efficient wafer handling in demanding environments. Whether you're working on cartesian XYZ systems, robotic arms/end-effectors, or AGVs and AMRs, Oriental Motor has a number of solutions to meet your specific needs.
For further technical information, sizing support, and to explore the wide range of motor solutions for semiconductor wafer handling, please contact our inside sales or technical support team to get started.
Automated system for flat or notched wafers; multiple orders to ship during third quarter of
Fremont, Calif. &#; August 25, &#; ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced the launch of ACM&#;s Ultra ECP GIII plating tool to support WLP for compound semiconductors, with product offerings for silicon carbide (SiC), gallium nitride (GaN) and gallium arsenide (GaAs). The tool is also capable of plating gold (Au) into backside deep hole processes with greater uniformity and better step coverage. The tool features a fully-automated platform to support high volume manufacturing that accommodates both flat and notched 6-inch wafers, and incorporates ACM&#;s proprietary second anode power and paddle technologies for optimal performance.
&#;The compound semiconductor market is growing rapidly with strong demand from electric vehicles, 5G communication, and RF and AI applications,&#; said David Wang, ACM&#;s Chief Executive Officer and President. &#;Historically, compound semiconductor manufacturing processes have seen limited levels of automation, and have been subject to restricted production volumes. Further, most plating has been performed by vertical-type plating tools with poor uniformity performance. ACM&#;s new Ultra ECP GIII plating tool overcomes these challenges to meet the growing volume and advanced performance demands for compound semiconductors.&#;
ACM&#;s Ultra ECP GIII tool leverages two key technologies to achieve performance benefits: ACM&#;s second anode and ACM&#;s paddle technology. ACM&#;s second anode technology delivers superior uniformity control by effectively tuning wafer-level plating performance to overcome issues created by electrical field distribution differences. It can be used to optimize big die at wafer edge area patterns and notch area to achieve plating uniformity within 3%.
ACM&#;s paddle technology achieves stronger agitation to enhance mass transfer, resulting in significantly better step coverage in deep holes. Improved step coverage enables a reduction in Au film thickness, achieving cost savings for the customer.
ACM has received two orders for the Ultra ECP GIII from China-based compound semiconductor manufacturers. The first order was delivered in July to support waferlevel packaging with copper&#;nickel&#;tin-silver plating modules using second anode technology, and was integrated with a vacuum pre-wet chamber and a post-clean chamber. The second order, scheduled to be delivered later in the quarter ending September 30, , is for a gold (Au) plating system.
Contact ACM to learn more about its Ultra ECP GIII tool and supported applications.
About ACM Research, Inc.
ACM develops, manufactures and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, stress-free polishing and thermal processes that is critical to advanced semiconductor device manufacturing as well as wafer-level packaging. The company is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield.
The ACM Research logo is a trademark of ACM Research, Inc. For convenience, this trademark appears in this press release without a &#; symbol, but that practice does not mean ACM will not assert, to the fullest extent under applicable law, its rights to the trademark.
For more information, please visit Automatic Wafer ( Horizontal ) Plating Machine.
